Home › Products › Electronic
aarema Underfill Materials
Semiconductor
High-performance capillary and no-flow underfill materials that encapsulate the gap between semiconductor chips and PCBs. Protects solder joints against thermal cycling, mechanical shock, and vibration stresses in demanding electronics applications.
Related searches: underfill materials India, BGA underfill, flip chip underfill, semiconductor underfill adhesive, aarema underfill
Specifications
| Brand | aarema |
|---|---|
| Type | Capillary & No-Flow |
| Application | Chip-to-Board Encapsulation |
| Cure | Thermal / UV |
Features
- Protects solder joints against thermal cycling and mechanical shock
- Low viscosity for excellent capillary flow under fine-pitch components
- Compatible with lead-free and Pb-free soldering processes
- Suitable for BGA, CSP, flip-chip and QFN packages
- Available in reworkable and non-reworkable formulations
- Halogen-free options available
Brand: aarema
Industries
Related Electronic products
- aarema SMD Adhesives
- aarema Sintered Materials
- aarema Glob-Top Dam & Fill Adhesives
- aarema Electrically Conductive Adhesives (Isotropic)
- aarema Electrically Conductive Adhesives (Anisotropic)
- aarema Die-Attach Adhesives
Request a quote for bulk orders across India.