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aarema Sintered Materials
Power Electronics
Nano-silver and nano-copper sintering pastes for high-reliability die attach in power electronics and wide-bandgap semiconductor devices. Provide exceptional thermal and electrical conductivity surpassing conventional solder, ideal for SiC and GaN power modules.
Related searches: silver sintering paste, sintered die attach India, power electronics sintering, pressureless sintering material, aarema sintered materials
Specifications
| Brand | aarema |
|---|---|
| Type | Nano-Silver / Nano-Copper Paste |
| Thermal Conductivity | >200 W/m·K (sintered) |
| Application | Power Die Attach |
Features
- Thermal conductivity >200 W/m·K — far exceeds conventional solder
- Excellent electrical conductivity for low-resistance die attach
- Lead-free and RoHS compliant — environmentally safe
- Compatible with SiC and GaN wide-bandgap power devices
- Pressure and pressure-less sintering processes available
- High reliability under extreme thermal cycling conditions
Brand: aarema
Industries
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Request a quote for bulk orders across India.