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aarema Glob-Top Dam & Fill Adhesives
Chip Protection
Two-part dam-and-fill encapsulation system for protecting bare chip, wire-bonded and flip-chip devices on PCBs. The dam material creates a containment barrier while the low-viscosity fill material flows around bond wires to provide full encapsulation and mechanical protection.
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Specifications
| Brand | aarema |
|---|---|
| Type | Dam & Fill Epoxy |
| Cure | UV / Thermal |
| Application | Bare Die Encapsulation |
Features
- Dam material holds shape without slumping during fill application
- Fill material flows around fine bond wires without voids
- Protects bare die from moisture, dust and mechanical damage
- Low modulus fill reduces stress on bond wires during thermal cycling
- Black-pigmented dam for optical masking where required
- UV and thermal cure options for process flexibility
Brand: aarema
Industries
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