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aarema Die-Attach Adhesives
Semiconductor
High-performance epoxy and silver-filled die-attach adhesives for securing semiconductor die to substrates, leadframes and PCBs. Engineered for high thermal cycling reliability in automotive, industrial and consumer electronics packaging applications.
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Specifications
| Brand | aarema |
|---|---|
| Type | Epoxy / Silver-Filled |
| Thermal Conductivity | 3–8 W/m·K |
| Application | Semiconductor Die Attach |
Features
- High bond strength for reliable die adhesion over thermal cycles
- Low stress formulation to minimize die-cracking risk
- Available in electrically conductive and non-conductive grades
- Low void content for consistent thermal performance
- Compatible with standard dispensing and stamping processes
- AEC-Q100 qualified grades for automotive electronics
Brand: aarema
Industries
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